GlobalFoundries Integrates Ope
GlobalFoundries, a semiconductor foundry with a global manufacturing footprint, announced it has officially integrated operations with Chartered Semiconductor Manufacturing and started functioning as one company under the GlobalFoundries brand.
catalog printingAccording to GlobalFoundries, the combined company employs approximately 10,000 people around the world, anchored by headquarters in Silicon Valley and manufacturing operations in Singapore; Dresden, Germany; and a fab under construction in Saratoga County, New York. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom.
The new GlobalFoundries immediately takes its position as one of the top semiconductor foundries in the world, with 2009 revenues to date for GlobalFoundries and Chartered in excess of $2 billion. GlobalFoundries launches with more than 150 customers across the semiconductor ecosystem, with plans to deepen existing relationships and to aggressively pursue new customers. Current customers include many of the world's top fabless and fab-lite companies, such as AMD, Qualcomm, STMicro and IBM.
"The entire premise of the foundry business is changing," said Dan Hutcheson, CEO of VLSI Research. "Foundry customers have made it clear that they are looking for collaboration with their foundry partners as opposed to a contract manufacturing service."
GlobalFoundries currently has five 200 mm fabs and one 300 mm fab in Singapore, as well as one leading-edge 300 mm fab complex in Dresden, Germany. To meet the demands of a growing customer base, the company has an aggressive capacity build-out plan, including expansion of Fab 1 in Dresden and Fab 7 in Singapore, as well as construction of a new leading-edge 300mm facility in Saratoga County, New York. The New York facility, which will be renamed as Fab 8, is on track to begin ramping initial production in 2012.
With these plans in place, global leading-edge capacity is expected to expand to 1.6 million 300mm wafers annually by 2014. This will be supplemented by 2.2 million 200mm wafers annually, offering customers a total of 5.8 million 200mm equivalents.
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